Toshiba just announced their next generation of flash memory chips. The new lineup consists of single-chip packages that combine a number 32 gigabit NAND flash chips and a controller into a single FBGA package. Using their 32 nanometer production process, the chips are significantly thinner than the previous generation.
Toshiba NAND chip
The new chips can be stacked up to 16 layers, enabling capacities of up to 64 gigabytes on a single chip. Samples of the largest unit are shipping this month, with mass production starting in the first quarter of 2010. Smaller units will follow at a later time; presumably they will be clearing stocks of old flash chips first.
Toshiba 16-layer NAND flash
All models announced today use MLC memory. The new chips comply with the e-MMC and JEDEC/MMCA Version 4.4 standards. This is the full list of part numbers and sizes:
| Part No | Capacity | Size | Shipping (samples) | Mass Production |
|---|---|---|---|---|
| THGBM2G9DGFBAI2 | 64 GB | 14x18x1.4 mm | Dec. 2009 | Q1 2010 |
| THGBM2G8D8FBAIB | 32 GB | 12x16x1.4 mm | Feb. 2010 | Q2 2010 |
| THGBM2G7D4FBAI9 | 16 GB | 12x16x1.2 mm | Jan. 2010 | Q1 2010 |
| THGBM2G6D2FBAI9 | 8 GB | 12x16x1.2 mm | Mar. 2010 | Q2 2010 |
| THGBM2G5D1FBAI9 | 4 GB | 12x16x1.2 mm | Apr. 2010 | Q2 2010 |
| THGBM2G4D1FBAI8 | 2 GB | 11.5x13x1.2 mm | Q2 2010 | Q3 2010 |
Why they are releasing a 2 GB model is beyond me; the flash chips they’re using have a 32 gigabit (4 GB) capacity, which means they’ll have to disable half of it to deliver a unit that small.
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