Following Toshiba’s announcement last month, Samsung has provided details about their next generation of NAND flash modules. Like Toshiba, the new modules offered by Samsung will be 16-layer stacks of 32 Gbit flash chips, providing a total of 64GB of storage per chip.
In addition to the new flash modules, they also announced a new microSD card with 32GB of storage capacity. It uses the same next-generation memory chips as the 64GB flash modules:
The 32GB microSD card, developed this month, stacks eight 32Gb NAND components and a card controller. The industry’s highest capacity, production-ready microSD card is enabled by the use of Samsung’s advanced 30-nm class 32Gb NAND flash memory technology. Previously, the highest density microSD card in production had a 16GB capacity and was based on 40nm-class 16Gb NAND. The new 32GB card is 1mm-thick. The portion of the card that is inserted into a handset measures just 0.7 mm in height.
The 64GB moviNAND modules have been in production since last month; samples of the SD card are being tested by OEMs.
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