Less than a year after announcing their 64GB NAND flash modules, Toshiba has already provided a shipping date for even bigger 128GB chips. They have done so by switching from 32 to 64 Gbit NAND chips, built on their 32nm process. Continue reading Toshiba doubles NAND flash module size to 128GB
Macronix International has been doing research on new ways of stacking NAND flach memory in more efficient manners than currently possible, by using a 3D structure instead of the current practice of just stacking flash chips on top of each other (2D stacking). Continue reading Macronix presents new 3D NAND Flash developments
IMFT, an Intel/Micron joint venture, announced they are sampling flash memory produced on their next-generation, 25nm production process. This latest shrink enables Intel to reach densities of 8 gigabytes per chip, reducing chip count for larger SSD’s and other memory devices.
Continue reading Intel/Micron joint venture readying 25nm flash memory
Following Toshiba’s announcement last month, Samsung has provided details about their next generation of NAND flash modules. Like Toshiba, the new modules offered by Samsung will be 16-layer stacks of 32 Gbit flash chips, providing a total of 64GB of storage per chip.
Continue reading Samsung also readying 64GB NAND flash modules
Toshiba just announced their next generation of flash memory chips. The new lineup consists of single-chip packages that combine a number 32 gigabit NAND flash chips and a controller into a single FBGA package. Using their 32 nanometer production process, the chips are significantly thinner than the previous generation.
Toshiba NAND chip
Continue reading Toshiba doubles NAND flash size
After over a month of speculation and rumors, the Sun F5100 has finally appeared on Sun’s website. Most of the details published earlier were correct; in fact, the performance figures quoted earlier were lower than what’s currently being quoted by Sun.
Sun F5100 front view
Continue reading Sun F5100 finally appears
During the Intel Developer Forum, Intel hasn’t limited itself to showing off their latest chipsets and CPU’s; PCWorld France reports about a demo from Intel that was running seven PCI-Express Solid State Drives, reaching (as far as I can decipher the French) a million I/O’s per second.
Intel PCI Express flash drive prototype
Continue reading IDF: Intel shows PCI-Express SSD solution reaching 1 million IOPS
OCZ is now shipping another Flash product: the Z-Drive. It is an internal drive, connected via an 8-lane PCI express bus. This makes the drive faster than SAS or SATA based solutions; the drive is available with both SLC and MLC memory, which enables customers to choose between the highest performance and a more affordable drive.
Continue reading Z-Drive: PCI-express flash drive from OCZ
After the discovery of documentation about Sun’s F5100 flash array two weeks ago, the internet was full of speculation about when it would be launched. The Register expects the final product to be revealed by Oracle as part of a demo machine that will shatter the TPC-C performance benchmark: Continue reading More (and less) about the Sun F5100
StorageMojo is one of the first sites to report about an exciting product that will (probably) be released by Sun soon: the F5100 flash array. It’s a 1U rackmount system that contains 80 flash modules. The main innovation for this system are the flash modules themselves; Sun uses an SO-DIMM socket to connect the flash modules. According to what I’ve heard so far the modules will initially be available with a capacity of 24 GB, with 48 GB versions following later to bring the total capacity of the array to 4TB. Continue reading F5100: 1U, 4TB flash storage from Sun